Two phase cooling has become a promising technique for removing high heat fluxes from electronic devices. In their article featured in Electronics Cooling, Dr. Yogendra K. Joshi and his PhD. student Pouya Asrar, and Dr.'s Andrei Fedorov, Craig E. Green, and Peter A. Kottke conducted research on flow visualization of flow boiling of refrigerant R245fa in a microgap with integrated staggered pin fins. Their conclusion is the enhanced microgap configuration offers a promising approach for two-phase thermal management of stacked chips.